Name: SnapSpeed PLA Filament (RFID) - 1KG
Brand: Snapmaker
SKU: 34071
Price: 22.99 USD
Availability: InStock
Rating: 4.9 (9 reviews)

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SnapSpeed PLA Filament (RFID) - 1KG

Snapmaker SnapSpeed PLA

High Speed

Stable Performance

Easy Print

Snapmaker SnapSpeed PLA

Snapmaker SnapSpeed PLA Filament spools with a winter cabin 3D print, highlighting high-speed, stable, easy-print PLA filament.

High Speed, High Stability

Optimized fluid dynamics enable speeds up to 300mm/s while ensuring smooth, high-quality prints.

Optimized Layer Adhesion

Strong layer adhesion ensures firm bonding and flawless prints, even at high speeds.

Smoother Prints, Finer Finish

SnapSpeed PLA ensures smooth extrusion and optimized cooling for sleek,
detailed prints with a refined finish, even at high speeds.

Tougher Than Ever

Engineered for durability and strength. Perfect for functional parts and prototypes.
Resilient in the face of everyday use.

Precision at High Speeds

Bubble-free vacuum spools feed flawlessly. Anti-clog heat control eliminates jams and flow breaks. Tangle-to-tip precision.

Sustainably Made, Responsibly Used

SnapSpeed PLA is made from 100% renewable plant-based resources and packaged with fully biodegradable cardboard spools, offering a safer choice for both users and the environment.

Specifications

RECOMMENDED PRINTING CONDITIONS5

*Based on a 0.4mm nozzle. Printing conditions may vary with different nozzle diameters.

Nozzle temperature

Classic: 190–210 °C
High-speed: 210–230 °C

Build plate temperature

25–60 °C

Build surface treatment

Glue when needed

Printing speed

Classic: 50-100mm/s
High-speed: 100-300mm/s

Drying setting

55°C for 6h

PHYSICAL PROPERTIES

Density

1.23g/cm³ at 21.5°C

Melt index

15.4 g/10min

THERMAL PROPERTIES

Glass transition temperature

59°C

Melting temperature

164°C

Crystallization temperature

96°C

Decomposition temperature

370°C

Vicat softening temperature

61°C

Heat deflection temperature (ISO 75 1.8MPa)

52°C

Heat deflection temperature (ISO 75 0.45MPa)

53°C

MECHANICAL PROPERTIES - Classic Speed

*Based on 0.4mm nozzle and 0.2mm layer thickness. Classic prirhting speed = 46.7mm/s, printing temperature = 210 °C

Young's modulus (X-Y)

2878.3±74.3 MPa

Young's modulus (Z)

2689.8±92.0 MPa

Tensile strength (X-Y)

46.0±0.5 MPa

Tensile strength (Z)

37.3±0.7 MPa

Elongation at break

21.5±5.02%

Elongation at break (Z)

4.2±2.0%

Bending modulus (X-Y)

2868.2±78.4 MPa

Bending strength (X-Y)

76.5±0.9 MPa

Charpy impact strength (X-Y)

6.1±0.6 kJ/m²

MECHANICAL PROPERTIES - High Speed

*Based on 0.4mm nozzle and 0.2mm layer thickness. High printing speed = 300mm/s, printing temperature = 230 °C

Young's modulus (X-Y)

2649.7±78.3 MPa

Young's modulus (Z)

2433.4±79.4 MPa

Tensile strength (X-Y)

43.9±0.4 MPa

Tensile strength (Z)

32.4±0.4 MPa

Elongation at break

15.1±3.9%

Elongation at break (Z)

3.3±0.5%

Bending modulus (X-Y)

2797.9±40.7 MPa

Bending strength (X-Y)

71.4±0.6 MPa

Charpy impact strength (X-Y)

5.0±0.5 kJ/m²

RECOMMENDED PRINTING CONDITIONS

*Based on a 0.4mm nozzle. Printing conditions may vary with different nozzle diameters.

Nozzle temperature

Classic: 190–210 °C
High-speed: 210–230 °C

Build plate temperature

25–60 °C

Build surface treatment

Glue when needed

Printing speed

Classic: 50-100mm/s
High-speed: 100-300mm/s

Drying setting

55°C for 6h

PHYSICAL PROPERTIES

Density

1.23g/cm³ at 21.5°C

Melt index

15.4 g/10min

THERMAL PROPERTIES

Glass transition temperature

59°C

Melting temperature

164°C

Crystallization temperature

96°C

Decomposition temperature

370°C

Vicat softening temperature

61°C

Heat deflection temperature (ISO 75 1.8MPa)

52°C

Heat deflection temperature (ISO 75 0.45MPa)

53°C

MECHANICAL PROPERTIES - Classic Speed

*Based on 0.4mm nozzle and 0.2mm layer thickness. Classic prirhting speed = 46.7mm/s, printing temperature = 210 °C

Young's modulus (X-Y)

2878.3±74.3 MPa

Young's modulus (Z)

2689.8±92.0 MPa

Tensile strength (X-Y)

46.0±0.5 MPa

Tensile strength (Z)

37.3±0.7 MPa

Elongation at break

21.5±5.02%

Elongation at break (Z)

4.2±2.0%

Bending modulus (X-Y)

2868.2±78.4 MPa

Bending strength (X-Y)

76.5±0.9 MPa

Charpy impact strength (X-Y)

6.1±0.6 kJ/m²

MECHANICAL PROPERTIES - High Speed

*Based on 0.4mm nozzle and 0.2mm layer thickness. High printing speed = 300mm/s, printing temperature = 230 °C

Young's modulus (X-Y)

2649.7±78.3 MPa

Young's modulus (Z)

2433.4±79.4 MPa

Tensile strength (X-Y)

43.9±0.4 MPa

Tensile strength (Z)

32.4±0.4 MPa

Elongation at break

15.1±3.9%

Elongation at break (Z)

3.3±0.5%

Bending modulus (X-Y)

2797.9±40.7 MPa

Bending strength (X-Y)

71.4±0.6 MPa

Charpy impact strength (X-Y)

5.0±0.5 kJ/m²

Frequently Asked Questions

1. How is SnapSpeed PLA different from standard PLA?

SnapSpeed PLA is designed specifically for high-speed FDM printing, supporting speeds of up to 300 mm/s. Its material flow, cooling performance, and layer adhesion are optimized to support stable extrusion and consistent surface quality under the recommended printing conditions. This makes it better suited to time-sensitive print jobs than standard PLA used mainly at conventional speeds.

2. What types of prints is SnapSpeed PLA Filament suitable for?

SnapSpeed PLA is recommended for rapid prototypes, functional parts, and general-purpose models where shorter print times are important. Reliable layer adhesion and durability also make the material suitable for prints that require regular handling or everyday use. SnapSpeed PLA is not suitable for parts exposed to sustained high temperatures.

3. What print speeds and temperatures should I use for SnapSpeed PLA?

Printing Mode	Print Speed	Nozzle Temperature	Build Plate Temperature
Classic	50–100 mm/s	190–210°C	25–60°C
High-speed	100–300 mm/s	210–230°C	25–60°C

These recommendations are based on a 0.4 mm nozzle. Printing conditions may vary with different nozzle diameters.

4. How can stable extrusion be maintained during high-speed printing?

SnapSpeed PLA Filament supports stable material flow during high-speed printing when used under the recommended conditions, including sufficient nozzle temperature, smooth filament feeding, dry filament, and a clean nozzle.

• Use a nozzle temperature of 210–230°C when printing at 100–300 mm/s.
• Make sure the spool unwinds freely and the filament moves smoothly through the feeding path.
• Keep the filament dry; if drying is needed, use the published setting of 55°C for 6 hours.
• Check that the nozzle is clean and free from partial blockages before high-speed printing.
• Adjust the temperature, speed, and related print parameters when using a nozzle other than 0.4 mm.

5. Is SnapSpeed PLA suitable for parts exposed to heat?

SnapSpeed PLA Filament is not recommended for prolonged high-temperature use. The material has a heat deflection temperature of 52–53°C and a Vicat softening temperature of 61°C. Printed parts may soften or deform near sustained heat sources and are therefore better suited to normal-temperature applications.

6. Does SnapSpeed PLA require any special setup?

SnapSpeed PLA does not require specialized printing hardware when used with a compatible FDM printer. Snapmaker U1 can recognize the filament automatically through RFID and load the corresponding preset information, reducing manual configuration. On other compatible printers, the material settings must be selected or entered manually according to the printer and nozzle being used.

SnapSpeed PLA Filament (RFID) - 1KG

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Fast Local Shipping

1-Year Warranty

Easy Returns

30-Day Price Match

Snapmaker SnapSpeed PLA

Snapmaker SnapSpeed PLA

High Speed, High Stability

Optimized Layer Adhesion

Smoother Prints, Finer Finish

Tougher Than Ever

Precision at High Speeds

Sustainably Made, Responsibly Used

Specifications

Frequently Asked Questions

1. How is SnapSpeed PLA different from standard PLA?

2. What types of prints is SnapSpeed PLA Filament suitable for?

3. What print speeds and temperatures should I use for SnapSpeed PLA?

4. How can stable extrusion be maintained during high-speed printing?

5. Is SnapSpeed PLA suitable for parts exposed to heat?

6. Does SnapSpeed PLA require any special setup?

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